[In Development] GND Slit Structure Flexible Circuit Board
The "GND slit structure technology" solves the issues of "dielectric thickness" and "transmission loss" that arise in microstrip line structures.
The "GND slit structure" under development addresses the challenges of "dielectric thickness" and "transmission loss" that arise in microstrip line structures. This technology allows for the reduction of dielectric thickness while maintaining transmission characteristics by incorporating a slit design in the GND plane directly beneath the RF line. As a result, it minimizes signal loss while maximizing flexibility. For high-speed transmission compatible YFC products (RFM, RFS series), we provide cable FPCs that reduce transmission loss by adopting the GND slit design, enabling low-loss signal transmission. Please refer to the PDF catalog for the measurement results of transmission loss and flexibility.
- Company:山下マテリアル
- Price:100,000 yen-500,000 yen